SkyHigh Memory is a technology leader that designs, develops, and markets high performance non-volatile Flash
Memory products for the following key markets: (i) automotive, (ii) communications, (iii) digital consumer, and (iv)
industrial and medical.
In 2018, in the peak of tightness in the market, SK Hynix and Cypress have recognized that customers have been
victim to opportunistic behavior in the market. Customers deserves the highest quality product and the world class
services without being penalized by the lack of access to SLC NAND products. That is why, in 2019, Cypress and
SK Hynix have jointly agreed to fund SkyHigh memory. SkyHigh is committed to provide unparallel quality product
and services to our customers and large supply.
In less than 6 months from its creation, SkyHigh will be introducing new SLC NAND and e.MMC products on the most
advanced technology node as commitment to offer cost reduction and product longevity to our customers.
For more information about these new products, please contact sales.
SkyHigh strength lies on its strong foundry and manufacturing partners and its employees. Its team of engineers and
sales is highly knowledgeable and is worldwide recognized for its commitment to provide the best in class product and
best services. From 2012, when SkyHigh’s SLC NAND product families were launched under Spansion banner, the team
has sold over 200M devices to leading customers in each of its target markets.
Some key elements of Skyhigh Memory strategy to become the leader for high reliable and performance storage
solution are based on:
Strong Collaborative Relationships with its foundry and manufacturing partners. We work in a highly collaborative
mode with our principal wafer foundry to develop leading edge process technology and provide “unlimited”
wafer capacity.
Strong Engineering team qualifying each product to Automotive standard. Proven record of delivering Automotive
grade devices to Automotive worldwide OEM Leaders.
Investing, Developing and Offering High Reliable and Performance Products.
Providing a World Wide Support to our customers.
Being a Long-Term and stable Supplier to our customers.
Leveraging our expertise in producing high-quality memory products to be the leader in our target markets.
For more information about SkyHigh Memory and our products, please contact your local sales representative.
Since beginning development of NAND Flash Memory in 2003, SK hynix has become a top 5 supplier with over 10%
share of the nearly $60 billion market in 2018.
SK hynix has provided SLC NAND to Cypress through a long-term supply agreement from 2012 to 2018.
SK hynix system ic, 100% subsidiary of SK hynix, entered into a joint venture agreement with Cypress Semiconductor
Corp. in October 2018.
Official launch of SkyHigh Memory took place on April 1, 2019. Since then, SkyHigh Memory supplies its high
performance, non-volatile Flash Memory products to customers worldwide.
SkyHigh Memory NAND products add reliable, high density data storage to the Cypress flash product line.
Cypress applies its stringent process for qualification, testing, extended temperature support and packaging to its line
of SLC NAND products.
SkyHigh Memory’s high performance and high reliability SLC NAND product portfolio includes two standard product families supporting 1bit and 4 bit ECC options. They are available in 1Gb to 16Gb densities.
SkyHigh Memory offers SLC NAND products with operating temperatures up to +105°C, compact packages to fit in
small form factors and meet stringent quality standards including AEC-Q100 for automotive applications.
All our NAND Flash Memory products are targeted specifically for data storage in Automotive Instrument Clusters and Infotainment Systems, Communication Equipment, Consumer Electronics and Industrial Automation. SLC Flash Memory Product OverviewPDF | 217 KB
Densities : 1Gb to 16Gb
Voltages : 3 V and 1.8 V options
Endurance : 100,000 P/E cycles (typical)
Data Retention : 10 years (typical)
ECC Requirements : 1-bit or 4-bit options
Bus Width : x8 or x16 options
Temperature :
Industrial temp range (-40°C to 85°C)
Industrial plus temp range (-40°C to 105°C)
Packages :
48-pin TSOP 12 mm x 20 mm
63-ball BGA 9 mm x 11 mm
67-ball BGA 8 mm x 6.5 mm
Open NAND Flash Interface (ONFI) 1.0 compliant
AEC-Q100 qualification
Complementary drivers and Cypress Flash File System (FFS)
For applications where security is a priority, SkyHigh Memory also offers the SL SecureNAND™ Flash Memory family
which provides enhanced protection features. Commodity SLC NAND Flash Memory products do not provide
security features required for storage of sensitive boot code, system firmware and applications.
SkyHigh Memory SecureNAND Flash Memory products provide volatile and nonvolatile block protection features that
can be used to protect boot code, system firmware and applications. With volatile block protection, a single block or a range of blocks can be chosen to lock the specified area until the next power cycle. With nonvolatile block protection,
a range of blocks or an expandable range of blocks can be locked permanently. This provides a greater amount of flexibility without having to worry about limitations on the number of blocks that need to be protected.
SkyHigh Memory SecureNAND Flash Memory products are available in densities from 1Gb to 4Gb and in the
industry-standard 63-ball BGA package. These products support the ONFI 1.0 NAND interface and include volatile and nonvolatile block protection features.
| Part Number | Page Size | Product Status | Density | Access Time | Packaging | Datasheet |
|---|---|---|---|---|---|---|
| S34ML08G3 | 4KB | For New Designs, Production | 8 Gb | 25 ns | 48-pin TSOP, 63 Ball BGA | |
| S34ML08G3 | 2KB | For New Designs, Production | 8 Gb | 25 ns | 48-pin TSOP, 63 Ball BGA | |
| S34ML04G3 | 4KB | For New Designs, Production | 4 Gb | 25 ns | 48-pin TSOP, 63 Ball BGA | |
| S34ML04G3 | 2KB | For New Designs, Production | 4 Gb | 25 ns | 48-pin TSOP, 63 Ball BGA | |
| S34ML02G3 | 2KB | For New Designs, Production | 2 Gb | 25 ns | 48-pin TSOP, 63 Ball BGA | |
| S34ML01G3 | 2KB | Sampling Soon | 1 Gb | 25 ns | 48-pin TSOP, 63 Ball BGA |
Temperature Range : Industrial (-40°C to +85°C), Industrial Plus (-40°C to +105°C), Automotive AEC-Q100 Grade 3 (-40°C to +85°C), Automotive AEC-Q100 Grade 2 (-40°C to +105°C)
| Part Number | Product Status | Density | Access Time | Packaging | Datasheet |
|---|---|---|---|---|---|
| S34MS08G2 | For New Designs, Production | 8 Gb | 45 ns | 63-Ball BGA | |
| S34MS04G2 | For New Designs, Production | 4 Gb | 45 ns | 48-pin TSOP, 63-Ball BGA | |
| S34MS02G2 | For New Designs, Production | 2 Gb | 45 ns | 48-pin TSOP, 63-Ball BGA | |
| S34MS01G2 | For New Designs, Production | 1 Gb | 45 ns | 48-pin TSOP, 63-Ball BGA, 67-ball |
| Part Number | Product Status | Density | Access Time | Packaging | Datasheet |
|---|---|---|---|---|---|
| S34ML16G2 | For New Designs, Production | 16 Gb | 25 ns | 48-pin TSOP, 63-ball BGA | |
| S34ML08G2 | For New Designs, Production | 8 Gb | 25 ns | 48-pin TSOP, 63-ball BGA | |
| S34ML04G2 | For New Designs, Production | 4 Gb | 25 ns | 48-pin TSOP, 63-ball BGA | |
| S34ML02G2 | For New Designs, Production | 2 Gb | 25 ns | 48-pin TSOP, 63-ball BGA | |
| S34ML01G2 | For New Designs, Production | 1 Gb | 25 ns | 48-pin TSOP, 63-Ball BGA, 67-ball |
Part Number | Product Status | Density | Access Time | Packaging | Datasheet |
|---|---|---|---|---|---|
| S34MS04G1 | Production | 4 Gb | 45 ns | 48-pin TSOP, 63-Ball BGA | |
| S34MS02G1 | Production | 2 Gb | 45 ns | 48-pin TSOP, 63-Ball BGA |
| Part Number | Product Status | Density | Access Time | Packaging | Datasheet |
|---|---|---|---|---|---|
| S34ML08G1 | Production | 8 Gb | 25 ns | 48-pin TSOP, 63-ball BGA | |
| S34ML04G1 | Production | 4 Gb | 25 ns | 48-pin TSOP, 63-ball BGA | |
| S34ML02G1 | Production | 2 Gb | 25 ns | 48-pin TSOP, 63-ball BGA |
| Part Number | Product Status | Density | Access Time | Packaging | Datasheet |
|---|---|---|---|---|---|
| S34SL04G2 | For New Designs, Production | 4 Gb | 25 ns | 63-ball BGA | |
| S34SL02G2 | For New Designs, Production | 2 Gb | 25 ns | 63-ball BGA | |
| S34SL01G2 | For New Designs, Production | 1 Gb | 25 ns | 63-Ball BGA |
The SkyHigh Memory ML-3 SPI NAND Flash family is offered in 1Gb to 4Gb densities. The family offers products with 3.3V VCC power supply, and x1, x2, x4 I/O interface. The page size is either (2048 + 128 spare) or (2048 + 64 spare) bytes. The bytes of spare area can be used for meta data or parity bits.
The ML-3 SPI NAND Flash family also provides enhanced security features for applications which need the highest security.
| Part Number | Page Size | Product Status | Density | Package Description | Package Dimension | Datasheet |
|---|---|---|---|---|---|---|
| S35ML04G3 | 2KB | For New Designs, Production | 4 Gb | 8-pin LGA | 6 x 8 mm | |
| S35ML02G3 | 2KB | For New Designs, Production | 2 Gb | 8-pin LGA | 6 x 8 mm | |
| S35ML01G3 | 2KB | For New Designs, Production | 1 Gb | 8-pin LGA | 6 x 8 mm |
“SkyHigh Memory offers a family of e.MMC 5.1 NAND Flash. These e.MMC products provide a highly efficient NAND flash memory, with an integrated controller and enhanced memory management. The e.MMC 51. Product family are offered in Industry standard and small form factor packages.
Our eMMC 5.1 NAND Flash is the optimal solution for large data storage in embedded applications
in the Communication, Consumer, and Industrial Segments.”
| Part Number | Product Status | Density | Package Description | Package Dimension | Datasheet |
|---|---|---|---|---|---|
| S40FC004 | Production | 4 GB | FBGA 153 | 11.5 x 13 x 0.8 mm | |
| S40FC004 | Production | 4 GB | FBGA 153 | 9.0 mm x 7.5 mm x 0.8 mm | |
| S40FC002 | Production | 2 GB | FBGA 153 | 11.5 x 13 x 0.8 mm | |
| S40FC002 | Production | 2 GB | FBGA 153 | 9.0 mm x 7.5 mm x 0.8 mm | |
| S40FC008 | Production | 8 GB | FBGA 153 | 11.5 x 13 x 0.8 mm | |
| S40FC0016 | Coming Soon | 16 GB |
SkyHigh Memory S6 Multi-Chip Package (MCP) product family, provides an integrated solution by stacking in one package 1.8V SLC NAND and 1.8V LPDRAM4xMemory components. This product family is designed for applications that need high reliability and performance with lower power consumption within small form factor.
SkyHigh Memory MCP products is currently available in 8Gb SLC NAND +8Gb LPDDR4x configuration and is offered in small JEDECcompliant 149-ball BGA packages. This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.
MCP NAND Product OverviewPDF | 973 KB
Densities : 8Gb IO width: x8
Voltages : 1.8V
Page Size : 2KB
Reliability : 100,000 P/E Cycles 10 years (typical)
ECC : 4bit ECC
Densities : 8Gb IO width: x16
Voltages : 1.8V, 1.1V
IO : 0.6V
Speed : 2133MHz
Bandwith : 4266Mb
-40°C to +85°C
-40°C to +105°C
149-ball WFBGA 9.5 x 8 x 0.7 mm
| Part Number | Product Status | Voltage | Density | I/O Bus | Package Dimension | Datasheet | ||
|---|---|---|---|---|---|---|---|---|
| SLC NAND | DRAM | SLC NAND | DRAM NAND | |||||
| S6AA8803 | Production | 1.8V | 8Gb | 8Gb | 8 | 16 | WBGA 149 | |
| S6AA1616 | Sampling | 1.8V | 16Gb | 16Gb | 8 | 16 | WBGA 149 | |
SkyHigh Memory S60 LPDDR4x and S70 LPDDR4x (Low Power Double Data Rate) memory product family is designed for applications that need high performance with lower power consumption.
Skyhigh Memory LPDDR4 and LPDDR4x product memory support I/O voltage respectively as low as 1.1V and 0.6V and I/O transfer rate as high to 4267 MT/s.
SkyHigh Memory LPDDR4/4x products is currently available in 8Gb and 16Gb and is offered in JEDEC compliant 200-ball BGA packages.
| Familly | Part Number | Product Status | Density | Package Description | Package Dimension | Datasheet |
|---|---|---|---|---|---|---|
| LPDDR4x | S60A08 | Production | 8Gb | FBGA 200 | 10 mm x 14.5 mm x 0.8 mm | |
| LPDDR4x | S60A16 | Sampling | 16Gb | FBGA 200 | 10 mm x 14.5 mm x 0.8 mm |
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