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Product Detail

Samsung eMMC

Samsung eMMC
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Product details
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Voltage
Temperature
Product Status
Interface
Package Size
Density
KLMEG4RCTE-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
256 GB
KLMCG1RCTE-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
64 GB
KLMDG2RCTE-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
128 GB
KLMCG2UCTB-B041
1.8 / 3.3 V
-25 ~ 85 °C
EOL
HS400
11.5 x 13 x 0.8 mm
64 GB
KLMDG4UCTB-B041
1.8 / 3.3 V
-25 ~ 85 °C
EOL
HS400
11.5 x 13 x 1.0 mm
128 GB
KLM4G1FETE-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11 x 10 x 0.8 mm
4 GB
KLM8G1GEUF-B04P
1.8 / 3.3 V
-40 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
8 GB
KLM8G1GEUF-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
8 GB
KLMAG2GEUF-B04P
1.8 / 3.3 V
-40 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
16 GB
KLMAG2GEUF-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
16 GB
KLMBG4GEUF-B04P
1.8 / 3.3 V
-40 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
32 GB
KLMBG4GEUF-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
32 GB
KLM8G1GESD-B03P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 0.8 mm
8 GB
KLM8G1GESD-B03Q
1.8 / 3.3 V
-40 ~ 105 °C
EOL
HS400
11.5 x 13 x 0.8 mm
8 GB
KLM8G1GESD-B04P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 0.8 mm
8 GB
KLM8G1GESD-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
EOL
HS400
11.5 x 13 x 0.8 mm
8 GB
KLM8G1GETF-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
8 GB
KLMAG1JETD-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
16 GB
KLMAG2GESD-B03P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 0.8 mm
16 GB
KLMAG2GESD-B03Q
1.8 / 3.3 V
-40 ~ 105 °C
EOL
HS400
11.5 x 13 x 0.8 mm
16 GB
KLMAG2GESD-B04P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 0.8 mm
16 GB
KLMAG2GESD-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
EOL
HS400
11.5 x 13 x 0.8 mm
16 GB
KLMBG2JETD-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 0.8 mm
32 GB
KLMBG4GESD-B03P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 1.0 mm
32 GB
KLMBG4GESD-B03Q
1.8 / 3.3 V
-40 ~ 105 °C
EOL
HS400
11.5 x 13 x 1.0 mm
32 GB
KLMBG4GESD-B04P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 1.0 mm
32 GB
KLMBG4GESD-B04Q
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 1.0 mm
32 GB
KLMCG4JETD-B041
1.8 / 3.3 V
-25 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 1.0 mm
64 GB
KLMCG4JEUD-B04P
1.8 / 3.3 V
-40 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 1.2 mm
64 GB
KLMCG4JEUD-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
Mass Production
HS400
11.5 x 13 x 1.2 mm
64 GB
KLMCG8GESD-B03P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 1.0 mm
64 GB
KLMCG8GESD-B03Q
1.8 / 3.3 V
-40 ~ 105 °C
EOL
HS400
11.5 x 13 x 1.0 mm
64 GB
KLMCG8GESD-B04P
1.8 / 3.3 V
-40 ~ 85 °C
EOL
HS400
11.5 x 13 x 1.0 mm
64 GB
KLMCG8GESD-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
EOL
HS400
11.5 x 13 x 1.0 mm
64 GB
KLMDG8JEUD-B04P
1.8 / 3.3 V
-40 ~ 85 °C
Mass Production
HS400
11.5 x 13 x 1.2 mm
128 GB
KLMDG8JEUD-B04Q
1.8 / 3.3 V
-40 ~ 105 °C
Mass Production
HS400
11.5 x 13 x 1.2 mm
128 GB
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